News Snapshot:
China’s Huawei Applied sciences is aggressively strengthening its chip packaging capabilities to mitigate the influence of US crackdowns limiting entry to key semiconductor manufacturing applied sciences, sources on this situation say in Nikkei Asia. Informed to. Chip packaging is the ultimate stage of semiconductor manufacturing, earlier than it’s mounted on a printed circuit board and assembled into an digital system. A lot of the associated applied sciences usually are not managed by American firms in contrast to the manufacture of the chips themselves. Washington has blocked Huawei’s entry to superior US chip manufacturing expertise since 2019 due to nationwide safety...
