China Advances Semiconductor Manufacturing with New Metrology System for Six-Inch Wafers

Hwatsing Technology, China’s leading producer of chemical mechanical polishing equipment, introduced a metrology system for six-inch wafers that can be integrated directly into the polishing workflow. This innovative system marks China’s first six-inch metrology system paired with CMP equipment. Unlike traditional methods of measuring wafers separately after processing, this system takes readings before and after polishing, providing live data feedback to the control system, as reported by the South China Morning Post. Chemical mechanical polishing is a critical process that ensures the silicon disc is flat and smooth between processing layers. The accuracy of this process is essential for modern…