News Snapshot:
China’s Huawei Technologies is aggressively ramping up its chip packaging capabilities to mitigate the impact of a U.S. crackdown that has kept the company from gaining access to vital semiconductor production technology, people familiar with the matter told Nikkei Asia. Chip packaging refers to the final step in semiconductor manufacturing before they are mounted on printed circuit boards and assembled into electronic devices. The technology is less controlled by U.S. companies than the manufacturing of the chips themselves. Since 2019, Washington has cut off Huawei’s access to advanced U.S. chipmaking technology on national security grounds. An example of Huawei’s new...
