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Qualcomm has agreed to license patents underpinning Huawei’s novel LogicFolding chipmaking technique, a win for the Chinese company and its push to advance in overseas AI markets. The multiyear deal is part of a cross-license agreement between the two chipmakers, spanning technologies related to 5G devices, AI services, near- and co-packaged optics and networks, a Huawei spokesperson said Monday. The agreement with Qualcomm helps validate the Shenzhen-based company’s chipmaking capabilities. Huawei sees its new architecture as a breakthrough that boosts semiconductor performance and helps it narrow the gap with industry leaders such as Taiwan Semiconductor Manufacturing Co. That approach focuses…
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