China’s Path to Advanced Chipmaking Machines by 2030, According to Nvidia CEO

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China is striving to close the gap in manufacturing the most advanced semiconductors domestically, with Nvidia CEO Jensen Huang expressing confidence in China’s potential to achieve this by 2030. Huang emphasized that China’s strength lies in high-volume production, suggesting that the country is on track to bridge the technological divide within the next 3 to 4 years. Shanghai Micro Electronics Equipment (SMEE), a prominent domestic lithography equipment manufacturer in China, currently produces a 193-nm ArF dry scanner, but its capabilities fall short of the latest chip manufacturing standards. While SMEE has reportedly developed a more advanced ArF immersion scanner for…

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