Cadence rolls out AI agent to speed circuit board, chip packaging design

SAN FRANCISCO, July ?15 (Reuters) – Cadence Design Systems on Wednesday launched an artificial-intelligence “super agent” ?that designs printed circuit boards and chip packages, extending the company’s push ?to automate more of the engineering process. The tool, called AuraStack, lets engineers describe their goals in plain language, then plans and carries out the work using Cadence’s existing software tools to ?lay out and virtually test circuit designs. Cadence ?said Nvidia chips will accelerate ?the AI work. Cadence said AuraStack can cut time to market by up to ?half ?and lift productivity on individual tasks as much as 15-fold. The AI…