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Suzhou-based RoboTechnik Intelligent Technology is fast emerging as a pivotal player in the global artificial intelligence supply chain. The company disclosed Monday that its optoelectronics and semiconductor division secured over 1 billion yuan (approximately US$141 million) in new orders during the first four months of 2026, driven by a surge in demand for next-generation optical interconnects. The order book highlights the growing industry shift toward Co-Packaged Optics (CPO), a technology essential for managing the heat and power consumption of AI data centers. RoboTechnik’s German subsidiary, ficonTEC, which is a specialist in ultra-precise automated packaging, is at the center of this…
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