Wuxi Tongbu Claims Major Yield Breakthrough in High-Frequency Hybrid PCB Production

In a strategic move to dominate the high-end electronics market, Wuxi Tongbu Electronic Technology has filed a patent for a novel high-frequency mixed-pressure Printed Circuit Board that promises yield rates between 83.3% and 92.5%. The patent, filed in early 2026 and now being reported by Chinese media, details a manufacturing process that solves the chronic industry headache of bonding mismatched materials into a single, high-performance motherboard. The technology centers on a sophisticated interconnect structure. By integrating multiple sub-boards with each utilizing specialized high-frequency cores and prepregs, Tongbu has engineered a vertical interconnect system using copper paste sintering. Unlike traditional drilling…