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Introducing New Solutions to Address Emerging Assembly Challenges SINGAPORE, March 24, 2026 /PRNewswire/ — Kulicke and Soffa Industries, Inc. (“K&S”, “Company”) today announced an expanded portfolio of memory-focused interconnect solutions, reinforcing its leadership across Ball, Vertical Wire, Advanced Thermo-Compression and Hybrid Bonding technologies. As memory assembly evolves to support higher bandwidth, greater power efficiency, and tighter integration for AI-driven workloads, manufacturers are increasingly constrained by transistor scaling and traditional interconnect density limitations. K&S is relentlessly focused on addressing this growing set of challenges, while also providing new innovative solutions to address the challenges of tomorrow. The company is pleased to…
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